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AI-powered manufacturing, autonomous vehicles, algorithmic drug discovery, smart grids. These and other innovations are creating new sources of value and enabling new business models. The common factor? Semiconductors. The computing power and connectivity that underpin innovation across industries rely on rapid, relentless advances in silicon speed and efficiency.
Yet this is also a time of uncertainty and transformation for chipmakers. Export controls, restrictions on critical materials, and shifting trade alliances are redefining the semiconductor landscape even as technological innovation continues. Now more than ever, industry leaders need to take a forward-looking approach, not only to maintain near-term competitiveness but also to understand how a new phase of industry reconfiguration could set value in motion.
PwC’s “Semiconductor and beyond” report provides insights for both semiconductor demanders and suppliers by analysing industry trends, demand across end markets, and the potential impact of emerging technologies.
The global semiconductor market is expected to grow at a compound annual growth rate (CAGR) of 8.6%, from around US$627 billion in 2024 to more than US$1 trillion in 2030. Overall end-market growth may be propelled by the transformative impact of AI across industries, while server and automotive market segments grow at the fastest pace.
The car of the future may be more than just a mode of transportation—it may be a new form of home, a high-performance computer on wheels, seamlessly powered by semiconductors.
Since the surge of generative AI applications in 2022, the amount of data generated and processed has expanded at an exponential rate. Servers and network equipment will likely be a backbone of intelligence permeating applications around us, powered by the continuous advancements of semiconductors.
Although the home appliances market is relatively saturated, the drive for AI and the Internet of Things (IoT) is changing appliances to become even smarter and provide a new consumer experience, equipped with more chips. Moreover, new appliances are gaining more market traction, such as AR/VR and wearable devices.
Although previously considered relatively saturated compared to other applications, the smartphone and PC markets are now facing new opportunities, driven by the growing demand for AI-optimised products such as on-device AI solutions.
Industries around us—including healthcare, agriculture, manufacturing, energy, and defence—are constantly evolving, driven by global demographic shifts, productivity improvements from new technologies, the rise of new products, and climate risks. Semiconductors can find their way deeper and deeper into more industries, driving efficiency and innovation.
Fabrication is not the sole factor determining chip performance; instead, it hinges significantly on the design stage, including intellectual property (IP) and electronic design automation (EDA). Territories are pursuing unique strategies to achieve leadership in AI, HPC, and various sectors. Amid this trend, design is evolving to emphasise low-power, customised chips tailored for specific applications and to enhance profit.
IPA and EDA are becoming more important, and increasingly costly. Companies are now strategising to reduce these expenses or enhance their utilisation.
Fabrication capacity is expected to grow at a CAGR of 7% by 2030, primarily driven by the demand for AI. Significant differences in territorial specialisation strategies are evident among the logic, memory, discrete, analogue, and optoelectronics subsectors of semiconductor manufacturing. The United States is striving to reclaim global semiconductor leadership, while China is focusing on achieving self-sufficiency. Although strategies differ by territory, the intense investments indicate that the semiconductor landscape may undergo significant growth by 2030.
As nodes advance toward smaller scales, there’s a growing focus on enhancing performance through advanced packaging. Techniques such as decreasing interconnect lengths for higher speeds and adopting chiplet architectures for cost-effective and flexible die combinations are emerging as key innovations. Additionally, the advancement in packaging technology has increased the importance of wafer testing, as it enables detection of defective dies at the die level, preventing a single defective die from rendering the entire package unusable.
Securing advanced manufacturing tools has become a prerequisite for expanding semiconductor supply capacity. Global semiconductor equipment investments are likely to grow at an annual rate of 7.4% until 2030, with over 70% of these investments concentrated in Asia. With evolving fabrication and packaging trends, combined with end users’ demand for higher-durability chips, materials such as silicon carbide and boron carbide are actively being adopted. These material innovations focus not only on cost reduction but also on extending lifespan to improve equipment utilisation.
PwC has selected technologies likely to have a substantial relationship with semiconductors. Beyond 2030, with numerous technological innovations, semiconductors will likely remain a key component, while shifting their role. Advanced AI, driverless cars, humanoid robots, quantum computing, and brain computer interface (BCI) are emerging with high potential and feasibility, raising questions for players to prepare beyond 2030.
You can read further about the new technological waves and what questions they bring for proactive leaders in the semiconductor industry.
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Global Semiconductors Leader
PwC United States
Global TMT Industry Leader, Partner
PwC China